Anti-counterfeiting detection
Inspection engineers, who ensure close monitoring of component dimensions, markings, pinouts, packaging, and other characteristics, must be consistent with manufacturer specifications.
Non-destructive testing is a series of inspection and quality inspection methods that are used to detect internal and external defects, voids and other abnormalities of components without affecting the performance or reliability of components.
Destructive testing is the last process of anti-counterfeiting testing. In specific cases, more intrusive testing methods, such as unpacking and testing for lead solderability, may help us confirm the authenticity of the product.
Open cover inspection is used to confirm chip size and manufacturer's trademark, check chip structure, and check component numbers, etc.
By measuring the adhesion strength and distribution, it is possible to detect whether the bonded chip or the material covering the surface of the chip is complete, and to test whether the product meets the bonding standard.
Find out how much usability remains by testing the solderability of component pins, confirming coating durability, and checking older products for corrosion and oxidation.
Heat reagent testing to detect signs of counterfeiting by detecting differences in sanding and texture, and surface encapsulation coverage.
In addition to the above detection methods, other anti-counterfeiting tests can be provided according to the specific requirements of customers. Please contact us.
